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Through silicon via to FinFET noise coupling in 3-D integrated circuits.

A. Abadi, W. Guo, X. Sun, K. Ali, J. Raskin, M. Rack, C. Neve, M. Choi, V. Moroz, G. der Plas, I. Wolf, E. Beyne, and P. Absil. ICICDT, page 1-4. IEEE, (2015)

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X Schmid

X Lin

X Roth

X Cheng

Yü-Sün Sun

Other publications of authors with the same name

Evidence for the Direct Two-Photon Transition from \$\psi'\$ to \$J/\psi\$B. Collaboration, M. Ablikim, M. Achasov, D. Ambrose, F. An, Q. An, Z. An, J. Bai, R. Ferroli, Y. Ban and 348 other author(s). (Apr 1, 2012)Measurements of the absolute branching fractions for \$D\_s^+\rightarrowe^+\nu\_e\$ and \$D\_s^+\rightarrow\eta^\prime e^+\nu\_e\$M. Ablikim, M. Achasov, X. Ai, O. Albayrak, M. Albrecht, D. Ambrose, A. Amoroso, F. An, Q. An, J. Bai and 415 other author(s). (Aug 23, 2016)Measurement of the \$D\_s^+ \ell^+\nu\_\ell\$ branching fractions and the decay constant \$f\_D\_s^+\$M. Ablikim, M. Achasov, X. Ai, O. Albayrak, M. Albrecht, D. Ambrose, A. Amoroso, F. An, Q. An, J. Bai and 408 other author(s). (Aug 24, 2016)Measurement of $e^+ e^- K^+ K^-$ cross section at $s = 2.00 - 3.08$ GeVB. Collaboration, M. Ablikim, M. Achasov, S. Ahmed, M. Albrecht, M. Alekseev, A. Amoroso, F. An, Q. An, J. Bai and 450 other author(s). (2018)cite arxiv:1811.08742Comment: 8 figures.Prevalence of autism in mainland China, Hong Kong and Taiwan: a systematic review and meta-analysis.X. Sun, C. Allison, F. Matthews, S. Sharp, B. Auyeung, S. Baron-Cohen, and C. Brayne. Mol Autism, 4 (1): 7 (2013)PMCID: PMC3643868.A review of healthcare service and education provision of Autism Spectrum Condition in mainland China.X. Sun, C. Allison, B. Auyeung, S. Baron-Cohen, and C. Brayne. Res Dev Disabil, 34 (1): 469--479 (January 2013)Multicomponent PP and PS seismic response from volcanic gas reservoirsX. Li, S. Chen, X. Sun, J. Pei, and H. Dai. 68th EAGE Conference and Exhibition, page A005+. Vienna, Austria, European Association of Geoscientists and Engineers, (June 2006)Some Fast Algorithms for Sequentially Semiseparable Representations.S. Chandrasekaran, P. Dewilde, M. Gu, T. Pals, X. Sun, A. van der Veen, and D. White. SIAM J. Matrix Anal. Appl., 27 (2): 341-364 (2005)Analysis of 3D interconnect performance: Effect of the Si substrate resistivity.X. Sun, G. der Plas, M. Detalle, and E. Beyne. 3DIC, page 1-4. IEEE, (2014)Electron mobility in thin In0.53Ga0.47As channel.E. Cartier, A. Majumdar, K. Lee, T. Ando, M. Frank, J. Rozen, K. Jenkins, C. Liang, C. Cheng, J. Bruley and 8 other author(s). ESSDERC, page 292-295. IEEE, (2017)

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Disambiguation of "Sun, X."

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Through silicon via to FinFET noise coupling in 3-D integrated circuits.

Please choose a person to relate this publication to

X Schmid

X Lin

X Roth

X Cheng

Yü-Sün Sun

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Sun, X."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Through silicon via to FinFET noise coupling in 3-D integrated circuits.

Please choose a person to relate this publication to

X Schmid

X Lin

X Roth

X Cheng

Yü-Sün Sun

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Through silicon via to FinFET noise coupling in 3-D integrated circuits.