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Disambiguation of "Lim, Sung Kyu"

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Monolithic 3D IC designs for low-power deep neural networks targeting speech recognition.

, , , , and . ISLPED, page 1-6. IEEE, (2017)

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Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

 

Other publications of authors with the same name

Retiming-based timing analysis with an application to mincut-based global placement., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (12): 1684-1692 (2004)Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 32 (11): 1694-1707 (2013)Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 34 (12): 1964-1976 (2015)Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs., , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 35 (10): 1707-1720 (2016)Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 42 (7): 2331-2335 (July 2023)Edge separability-based circuit clustering with application to multilevel circuit partitioning., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (3): 346-357 (2004)TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (8): 1194-1207 (2012)Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs., , , , , and . DATE, page 37-42. IEEE, (2020)MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration., , , , , , , , and . CoRR, (2021)Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators., , , , , , and . CoRR, (2020)