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Configurable serial fault-tolerant link for communication in 3D integrated systems.

, , , and . IOLTS, page 115-120. IEEE Computer Society, (2010)

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Communication Aware Recovery Configurations for Networks-on-Chip., , and . IOLTS, page 201-206. IEEE Computer Society, (2008)RILM: Reconfigurable inter-layer routing mechanism for 3D multi-layer networks-on-chip., , and . IOLTS, page 121-126. IEEE Computer Society, (2010)Configurable fault-tolerant link for inter-die communication in 3D on-chip networks., , , and . European Test Symposium, page 258. IEEE Computer Society, (2010)Error resilience of intra-die and inter-die communication with 3D spidergon STNoC., , , , and . DATE, page 275-278. IEEE Computer Society, (2010)Multiple Event Transient Induced by Nuclear Reactions in CMOS Logic Cells., , , , , , , , , and 1 other author(s). IOLTS, page 137-145. IEEE Computer Society, (2007)Adaptive inter-layer message routing in 3D networks-on-chip., , and . Microprocess. Microsystems, 35 (7): 613-631 (2011)Configurable serial fault-tolerant link for communication in 3D integrated systems., , , and . IOLTS, page 115-120. IEEE Computer Society, (2010)Improving the scalability of checkpoint recovery for networks-on-chip., , and . ISCAS, page 2793-2796. IEEE, (2008)Coordinated versus Uncoordinated Checkpoint Recovery for Network-on-Chip Based Systems., , and . DELTA, page 32-37. IEEE Computer Society, (2008)