Author of the publication

Bearing gap adjustment for improvement of levitation performance in a hydrodynamically levitated centrifugal blood pump.

, , , , , and . EMBC, page 3295-3298. IEEE, (2015)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Noninvasive miniaturized mass-flow meter using a curved cannula for implantable axial flow blood pump., , , and . EMBC, page 1343-1346. IEEE, (2011)Recover-Forwarding Method in Link Failure with Pre-Established Recovery Table for Wide Area Ethernet., , , , , and . ICC, page 1-5. IEEE, (2009)Reaction mechanism of blood coagulation factors in shear flow field., , , , , and . EMBC, page 4309-4312. IEEE, (2016)Multi-Domain VLAN Path Signaling Method Having Tag Swapping Function for GMPLS Controlled Wide Area Layer-2 Network., , , , and . IEICE Trans. Commun., 92-B (4): 1353-1356 (2009)Interoperability Experiment of VLAN Tag Swapped Ethernet and Transmitting High Definition Video through the Layer-2 LSP between Japan and Belgium., , , , , , , , , and . IEICE Trans. Commun., 93-B (3): 736-740 (2010)Scenario for catastrophic failure in interconnect structures under chip package interaction., , , , , , , , , and . IRPS, page 5. IEEE, (2015)Development of a photon-cell interactive monte carlo simulation for non-invasive measurement of blood glucose level by Raman spectroscopy., , , and . EMBC, page 6409-6412. IEEE, (2015)Noninvasive blood-flow meter using a curved cannula with zero compensation for an axial flow blood pump., , , , and . EMBC, page 4090-4093. IEEE, (2013)Fluid dynamic design for low hemolysis in a hydrodynamically levitated centrifugal blood pump., , , , , , and . EMBC, page 2732-2735. IEEE, (2013)Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures., , , , , , , , , and 1 other author(s). Microelectron. Reliab., 53 (4): 612-621 (2013)