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Disambiguation of "Colonna, Jean-Philippe"

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Graphite-based heat spreaders for hotspot mitigation in 3D ICs.

, , , , , and . 3DIC, page TS10.4.1-TS10.4.4. IEEE, (2015)

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Jean-Philippe Kohl

Jean-Philippe Dubus

Gérard Jean-Philippe

Jean-Philippe Haumesser

Jean-Philippe Leresche

 

Other publications of authors with the same name

Thermal correlation between measurements and FEM simulations in 3D ICs., , , , , , , , , and 4 other author(s). 3DIC, page 1-6. IEEE, (2013)Graphite-based heat spreaders for hotspot mitigation in 3D ICs., , , , , and . 3DIC, page TS10.4.1-TS10.4.4. IEEE, (2015)Using TSVs for thermal mitigation in 3D circuits: Wish and truth., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2014)3D integration demonstration of a wireless product with design partitioning., , , , , , , , , and 17 other author(s). 3DIC, page 1-5. IEEE, (2011)Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells., , , , , , , , , and 2 other author(s). ISVLSI, page 539-544. IEEE Computer Society, (2017)Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits., , , , , , , , , and 6 other author(s). IEEE Des. Test, 33 (3): 21-36 (2016)Which interconnects for which 3D applications? Status and perspectives., , , , , and . 3DIC, page 1-6. IEEE, (2013)Heat spreading packaging solutions for hybrid bonded 3D-ICs., , , , , , , , , and 2 other author(s). 3DIC, page 1-6. IEEE, (2016)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes., , , , , , and . 3DIC, page 1-5. IEEE, (2016)Thermal performance of 3D ICs: Analysis and alternatives., , , , and . 3DIC, page 1-7. IEEE, (2014)