Author of the publication

Electrothermal engineering in the nanometer era: from devices and interconnects to circuits and systems.

, , and . ASP-DAC, page 223-230. IEEE, (2006)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Are carbon nanotubes the future of VLSI interconnections?, and . DAC, page 809-814. ACM, (2006)Introspective 3D chips., , , , , and . ASPLOS, page 264-273. ACM, (2006)Electrothermal engineering in the nanometer era: from devices and interconnects to circuits and systems., , and . ASP-DAC, page 223-230. IEEE, (2006)Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 28 (7): 1047-1060 (2009)High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate., , and . DATE, page 426-431. ACM, (2008)3D Integration for Introspection., , , , , and . IEEE Micro, 27 (1): 77-83 (2007)A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy., , , , , and . DAC, page 991-996. ACM, (2006)A Thermally-Aware Methodology for Design-Specific Optimization of Supply and Threshold Voltages in Nanometer Scale ICs., , and . ICCD, page 411-416. IEEE Computer Society, (2005)Impact of On-chip Inductance on Power Distribution Network Design for Nanometer Scale Integrated Circuits., , and . ISQED, page 346-351. IEEE Computer Society, (2005)Can Carbon Nanotubes Extend the Lifetime of On-Chip Electrical Interconnections?, , and . Nano-Net, page 1-9. IEEE, (2006)