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A vertically integrated and interoperable multi-vendor synthesis flow for predictable noc design in nanoscale technologies.

, , , , , and . ASP-DAC, page 337-342. IEEE, (2014)

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Supporting vertical links for 3D networks-on-chip: toward an automated design and analysis flow., , and . Nano-Net, page 15. ICST/ACM, (2007)A post-compiler approach to scratchpad mapping of code., , , , and . CASES, page 259-267. ACM, (2004)Towards Ultrasound Everywhere: A Portable 3D Digital Back-End Capable of Zone and Compound Imaging., , , , , , , and . IEEE Trans. Biomed. Circuits Syst., 12 (5): 968-981 (2018)Quest for the ultimate network-on-chip: the NaNoC project., , , , , , , , and . INA-OCMC@HiPEAC, page 43-46. ACM, (2012)Comparison of a Timing-Error Tolerant Scheme with a Traditional Re-transmission Mechanism for Networks on Chips., , , , , , and . SoC, page 1-4. IEEE, (2006)Tackling the bottleneck of delay tables in 3D ultrasound imaging., , , , , , and . DATE, page 1683-1688. ACM, (2015)A Network Traffic Generator Model for Fast Network-on-Chip Simulation., , , , , and . DATE, page 780-785. IEEE Computer Society, (2005)A Layout-Aware Analysis of Networks-on-Chip and Traditional Interconnects for MPSoCs., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (3): 421-434 (2007)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology., , , , , , , , , and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)Characterization and Implementation of Fault-Tolerant Vertical Links for 3-D Networks-on-Chip., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 30 (1): 124-134 (2011)