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Disambiguation of "Tummala, Rao R."

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Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.

, , , , and . Microelectron. Reliab., 53 (1): 70-78 (2013)

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Bharathi Vasudeva Rao

Yadlapalli Venkateswara Rao

Balakrishna Rao

Sonti Venkata Suryanarayana Rao

Nidamboor Vasanth Rao

 

Other publications of authors with the same name

Miniaturized and high-performance RF packages with ultra-thin glass substrates., , , , , , , , and . Microelectron. J., (2018)High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution., , , , , , , , , and 1 other author(s). IBM J. Res. Dev., 36 (5): 889-904 (1992)System on Chip or System on Package?, and . IEEE Des. Test Comput., 16 (2): 48-56 (1999)Analysis and optimization of a power distribution network in 2.5D IC with glass interposer., , , , , , , and . 3DIC, page 1-4. IEEE, (2014)Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test., , , , and . Microelectron. Reliab., 53 (1): 70-78 (2013)System Scaling With Nanostructured Power and RF Components., , , , and . Proc. IEEE, 105 (12): 2330-2346 (2017)Multichip packaging-a tutorial.. Proc. IEEE, 80 (12): 1924-1941 (1992)Gigabit wireless: system-on-a-package technology., and . Proc. IEEE, 92 (2): 376-387 (2004)High Performance Packaged Electronics for the IBM ES9000TM Mainframe., , , , , and . ICCD, page 534-539. IEEE Computer Society, (1991)