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Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias.

, , , , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 373-384 (2016)

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Electrically Programmable Fuse (eFUSE): From Memory Redundancy to Autonomic Chips., , , , , , , , , and . CICC, page 799-804. IEEE, (2007)Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias., , , , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 373-384 (2016)3D-Split SRAM: Enabling Generational Gains in Advanced CMOS., , , , , , , , , and 6 other author(s). CICC, page 1-2. IEEE, (2021)Field Tolerant Dynamic Intrinsic Chip ID Using 32 nm High-K/Metal Gate SOI Embedded DRAM., , , , , , and . IEEE J. Solid State Circuits, 48 (4): 940-947 (2013)An 800-MHz embedded DRAM with a concurrent refresh mode., , , , , , , , , and 4 other author(s). IEEE J. Solid State Circuits, 40 (6): 1377-1387 (2005)Monolithic Silicon Photonics., , , , , , , , , and 24 other author(s). BCICTS, page 263-269. IEEE, (2023)Hybrid III-V laser integration on a monolithic silicon photonic platform., , , , , , , , , and 39 other author(s). OFC, page 1-3. IEEE, (2021)Polarization mode dispersion in CMOS-integrated monolithic SiPh components: simulations and experiments., , , , , , , , , and 42 other author(s). OFC, page 1-3. IEEE, (2023)A Self-Authenticating Chip Architecture Using an Intrinsic Fingerprint of Embedded DRAM., , , , , and . IEEE J. Solid State Circuits, 48 (11): 2934-2943 (2013)Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias., , , , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 6 (3): 373-384 (2016)