( en | de | ru )

 

Disambiguation of "Jain, Palkesh"

Author of the publication

copydeleteadd this publication to your clipboard
Cell-Internal Electromigration: Analysis and Pin Placement Based Optimization.

, , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 35 (2): 220-231 (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Gora Jain

Tushar Jain

Prabhat Jain

Rajiv Jain

Arpit Jain

 

Other publications of authors with the same name

A Fast and Retargetable Framework for Logic-IP-Internal Electromigration Assessment Comprehending Advanced Waveform Effects., , and . IEEE Trans. Very Large Scale Integr. Syst., 24 (6): 2345-2358 (2016)Encoder-Decoder Networks for Analyzing Thermal and Power Delivery Networks., , , , , and . CoRR, (2021)Stochastic and topologically aware electromigration analysis for clock skew., , and . IRPS, page 3. IEEE, (2015)Algorithms and methodologies for interconnect reliability analysis of integrated circuits.. Polytechnic University of Catalonia, Spain, (2017)NanoTherm: An Analytical Fourier-Boltzmann Framework for Full Chip Thermal Simulations., , , and . ICCAD, page 1-8. ACM, (2019)Asymmetric Aging: Introduction and Solution for Power-Managed Mixed-Signal SoCs., , , and . IEEE Trans. Very Large Scale Integr. Syst., 22 (3): 691-695 (2014)Encoder-Decoder Networks for Analyzing Thermal and Power Delivery Networks., , , , , and . ACM Trans. Design Autom. Electr. Syst., 28 (1): 3:1-3:27 (January 2023)Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays., , , and . DAC, page 21:1-21:6. ACM, (2017)Impact on performance, power, area and wirelength using electromigration-aware cells., , , , and . ICECS, page 129-132. IEEE, (2015)Fast Stochastic Analysis of Electromigration in Power Distribution Networks., , and . IEEE Trans. Very Large Scale Integr. Syst., 25 (9): 2512-2524 (2017)