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Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.

, , , and . Microelectron. Reliab., 53 (2): 297-302 (2013)

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A counterexample of stability margin evaluation for uncertain linear systems., and . IEEE Trans. Automat. Contr., 45 (10): 1934-1935 (2000)Automatic Chinese Handwriting Verification Algorithm Using Deep Neural Networks., and . ISPACS, page 1-2. IEEE, (2019)Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA., , , , and . Microelectron. Reliab., 51 (8): 1372-1376 (2011)A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation., , , , and . IEEE Trans. Circuits Syst. I Regul. Pap., 64-I (6): 1308-1317 (2017)A High-Precision Bandgap Reference With a V-Curve Correction Circuit., , , , , , and . IEEE Access, (2020)Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology., , , , , , and . ICCE-TW, page 1-2. IEEE, (2019)Comments regarding "Stability margin evaluation for uncertain linear systems" and counterexample., , , and . IEEE Trans. Automat. Contr., 45 (10): 1933-1935 (2000)NASTAR: Noise Adaptive Speech Enhancement with Target-Conditional Resampling., , , , , and . INTERSPEECH, page 1183-1187. ISCA, (2022)LC4SV: A Denoising Framework Learning to Compensate for Unseen Speaker Verification Models., , , , , and . ASRU, page 1-8. IEEE, (2023)Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile., , , and . Microelectron. Reliab., 53 (2): 297-302 (2013)