( en | de | ru )

 

Disambiguation of "Colonna, Jean-Philippe"

Author of the publication

copydeleteadd this publication to your clipboard
Using TSVs for thermal mitigation in 3D circuits: Wish and truth.

, , , , , , , , , , and . 3DIC, page 1-8. IEEE, (2014)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Jean-Philippe Kohl

Jean-Philippe Dubus

Gérard Jean-Philippe

Jean-Philippe Haumesser

Jean-Philippe Leresche

 

Other publications of authors with the same name

Thermal correlation between measurements and FEM simulations in 3D ICs., , , , , , , , , and 4 other author(s). 3DIC, page 1-6. IEEE, (2013)Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells., , , , , , , , , and 2 other author(s). ISVLSI, page 539-544. IEEE Computer Society, (2017)Graphite-based heat spreaders for hotspot mitigation in 3D ICs., , , , , and . 3DIC, page TS10.4.1-TS10.4.4. IEEE, (2015)Using TSVs for thermal mitigation in 3D circuits: Wish and truth., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2014)3D integration demonstration of a wireless product with design partitioning., , , , , , , , , and 17 other author(s). 3DIC, page 1-5. IEEE, (2011)Thermal performance of 3D ICs: Analysis and alternatives., , , , and . 3DIC, page 1-7. IEEE, (2014)Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits., , , , , , , , , and 6 other author(s). IEEE Des. Test, 33 (3): 21-36 (2016)Heat spreading packaging solutions for hybrid bonded 3D-ICs., , , , , , , , , and 2 other author(s). 3DIC, page 1-6. IEEE, (2016)Which interconnects for which 3D applications? Status and perspectives., , , , , and . 3DIC, page 1-6. IEEE, (2013)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes., , , , , , and . 3DIC, page 1-5. IEEE, (2016)