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2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC., , , , , , , , , and 9 other author(s). ISSCC, page 50-52. IEEE, (2020)10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor., , , , , , , , , and 18 other author(s). ISSCC, page 180-181. IEEE, (2014)Scanning tunneling microscopy of quasi-one-dimensional charge-density wave materials. University of Illinois Urbana-Champaign, USA, (1991)A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC., , , , , , , , , and 16 other author(s). ISSCC, page 50-52. IEEE, (2022)Expediting ramp-to-volume production., , , , , , and . ITC, page 103-112. IEEE Computer Society, (1999)2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Subsystem-Based 5G Mobile SoC., , , , , , , , , and 10 other author(s). ISSCC, page 36-38. IEEE, (2024)A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem., , , , , , , , , and 20 other author(s). ISSCC, page 54-56. IEEE, (2021)