Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Semiconductor wafer representation for TCAD., , , , , , , , , and 2 other author(s). IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 13 (1): 82-95 (1994)The intertool profile interchange format: a technology CAD environment approach semiconductor technology., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 10 (9): 1157-1162 (1991)Linking TCAD to EDA - Benefits and Issues., , , , , and . DAC, page 573-578. ACM, (1991)The intertool profile interchange format: an object-oriented approach semiconductor technology CAD/CAM., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 10 (9): 1150-1156 (1991)A utility-based integrated system for process simulation., , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 11 (7): 911-920 (1992)