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Package geometric aware thermal analysis by infrared-radiation thermal images.

, , , , and . DATE, page 1-4. European Design and Automation Association, (2014)

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Contactless Stacked-die Testing for Pre-bond Interposers., , , , and . DAC, page 8:1-8:6. ACM, (2014)Thermal-Aware On-Line Scheduler for 3-D Many-Core Processor Throughput Optimization., , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 33 (5): 763-773 (2014)Package geometric aware thermal analysis by infrared-radiation thermal images., , , , and . DATE, page 1-4. European Design and Automation Association, (2014)