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Disambiguation of "Kim, Joungho"

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Noise coupling modeling and analysis of through glass via(TGV).

, , , , and . 3DIC, page TS8.34.1-TS8.34.5. IEEE, (2015)

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Ky ng Kim

Die Artikelstruktur in passiven zweisprachigen Wörterbüchern Deutsch-Koreanisch: Konzeption zur Erstellung eines zweisprachigen Lernerwörterbuchs Deutsch-Koreanisch. Uni Heidelberg, (2008)

Kim Kressel

Sangho Kim

Youngmin Kim

Kim Redecker

 

Other publications of authors with the same name

EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field., , , , , , , , and . IEEE Trans. Ind. Electron., 65 (9): 6839-6849 (2018)Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material., , , , , , , , and . IEEE Trans. Ind. Electron., 66 (5): 4054-4064 (2019)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)Signal integrity modeling and measurement of TSV in 3D IC., and . ASP-DAC, page 13-16. IEEE, (2013)Design of a Low-Noise UWB Transceiver SiP., , , , , , and . IEEE Des. Test Comput., 25 (1): 18-28 (2008)Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design., , , and . CoRR, (2022)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs., , , , , , and . 3DIC, page 1-6. IEEE, (2014)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Eye-diagram simulation and analysis of a high-speed TSV-based channel., , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC., , , , , , , , , and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)