( en | de | ru )

 

Disambiguation of "Billoint, Olivier"

Author of the publication

copydeleteadd this publication to your clipboard
Recent advances in 3D VLSI integration.

, , , , , , , , , , , , , , , , and . ICICDT, page 1-4. IEEE, (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Olivier Coutand

Paul Olivier

Christoph Olivier

Olivier Brede

Hans Olivier

 

Other publications of authors with the same name

16kbit 1T1R OxRAM arrays embedded in 28nm FDSOI technology demonstrating low BER, high endurance, and compatibility with core logic transistors., , , , , , , , , and 20 other author(s). IMW, page 1-4. IEEE, (2021)An Unbalanced Area Ratio Study for High Performance Monolithic 3D Integrated Circuits., , , and . ISVLSI, page 350-355. IEEE Computer Society, (2015)From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose., , , , , , , , and . 3DIC, page 1-5. IEEE, (2016)Intermediate BEOL process influence on power and performance for 3DVLSI., , , , , , , and . 3DIC, page TS1.3.1-TS1.3.5. IEEE, (2015)Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations., , , , , , and . 3DIC, page 1-5. IEEE, (2019)Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process., , , , and . MWSCAS, page 704-707. IEEE, (2021)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes., , , , , , and . 3DIC, page 1-5. IEEE, (2016)3DCoB: A new design approach for Monolithic 3D Integrated circuits., , , and . ASP-DAC, page 79-84. IEEE, (2014)Impact of intermediate BEOL technology on standard cell performances of 3D VLSI., , , , , , , , , and 3 other author(s). ESSDERC, page 218-221. IEEE, (2016)A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit., , , , , , , , and . ICICDT, page 141-144. IEEE, (2018)