( en | de | ru )

 

Disambiguation of "Take, Yasuhiro"

Author of the publication

copydeleteadd this publication to your clipboard
Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces.

, , , , , , and . ESSCIRC, page 105-108. IEEE, (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Heinrich Take

Yasuhiro Murakawa

Ingo Take

Yasuhiro Arahata

Yasuhiro Shirasaki

 

Other publications of authors with the same name

Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card., , , , , , and . IEEE J. Solid State Circuits, 47 (10): 2484-2495 (2012)A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface., , , , , , , , , and 1 other author(s). IEEE Micro, 33 (6): 6-15 (2013)Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer., , , , , , , , and . VLSIC, page 82-. IEEE, (2015)Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface., , , , and . ASP-DAC, page 44-45. IEEE, (2015)Design and analysis for ThruChip design for manufacturing (DFM)., , , , , and . ASP-DAC, page 46-47. IEEE, (2015)Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration., , , and . IEICE Trans. Electron., 98-C (4): 288-297 (2015)Low-latency wireless 3D NoCs via randomized shortcut chips., , , , , , , , and . DATE, page 1-6. European Design and Automation Association, (2014)Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs., , , , and . IEICE Trans. Inf. Syst., 96-D (12): 2753-2764 (2013)A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel., , , , , and . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 98-A (12): 2584-2591 (2015)3D clock distribution using vertically/horizontally-coupled resonators., , , and . ISSCC, page 258-259. IEEE, (2013)