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New methodology for thermal analysis of multi-core processors based on dedicated ASIC., , , , , , and . Microelectron. J., 44 (7): 623-630 (2013)Software Technology for WAP Based M-Commerce - A Comparative Study of Toolkits for the Development of Mobile Applications., , and . ICWI, page 673-676. IADIS, (2002)A Capacitive 3-Axis MEMS Accelerometer for Medipost: A Portable System Dedicated to Monitoring Imbalance Disorders., , , , , , , , , and . Sensors, 21 (10): 3564 (2021)Resilience, Production Yield and Self-Configuration in the Future Massively Defective Nanochips., and . IOLTS, page 259. IEEE Computer Society, (2007)Application of Offset Trimming Circuit for Reducing the Impact of Parasitics in Capacitive Sensor Readout Circuit., , , and . MIXDES, page 178-181. IEEE, (2019)Influence of Scaling on IC Temperature in FinFET Microprocessor Technologies., , , and . MIXDES, page 312-315. IEEE, (2013)Application of a genetic algorithm for dimension optimization of the MEMS-based accelerometer., , , , , and . MIXDES, page 352-354. IEEE, (2013)Evaluating the impact of scaling on temperature in FinFET-technology multicore processors., , , and . Microelectron. J., 45 (12): 1806-1813 (2014)Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling., , and . Microelectron. Reliab., (2017)Impact of floorplanning and thermal vias placement on temperature in 2D and 3D processors., , , and . Microelectron. J., (2016)