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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator.

, , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)

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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)Benefits of three-dimensional circuit stacking for image sensors., , , and . NEWCAS, page 1-4. IEEE, (2013)Systemc modelization for fast validation of imager architectures., , and . DASIP, page 341-345. IEEE, (2011)Pixel-level ADC by small charge quantum counting., , , , and . ICECS, page 423-426. IEEE, (2006)A photovoltaic mode pixel Embedding energy harvesting capability For future self-powered image sensors., , and . NEWCAS, page 261-264. IEEE, (2018)Capteur d'images à grande dynamique et compression intégrée pour technologie 3D., , , and . Traitement du Signal, 30 (6): 343-365 (2013)Performances of an highly parallel image processing chain for capturing high dynamic range video., , , , and . ICECS, page 403-406. IEEE, (2014)On compensating unknown pixel behaviors for image sensors with embedded processing., , , , and . ACSSC, page 933-937. IEEE, (2014)Correlated Multiple Sampling impact analysis on 1/fE noise for image sensors., and . IMSE, page 1-6. Society for Imaging Science and Technology, (2019)Comparison of two optimized readout chains for low light CIS., , , and . IMSE, volume 9022 of SPIE Proceedings, page 90220H. SPIE, (2014)