Inproceedings,
High-Baudrate SiP and InP Modulators for Data Center Interconnects.
O. Ozolins, A. Ostrovskis, T. Salgals, B. Krüger, F. Pittalà, M. Joharifar, R. Schatz, M. Koenigsmann, Y. Fan, U. Westergren, H. Mardoyan, L. Zhang, S. Spolitis, X. Yu, M. Gruen, V. Bobrovs, H. Louchet, and X. Pang.SoftCOM, page 1-3. IEEE, (2023)
Meta data
- BibTeX key
- conf/softcom/OzolinsOSKPJSKFWMZSYGBLP23
- entry type
- inproceedings
- booktitle
- SoftCOM
- year
- 2023
- pages
- 1-3
- publisher
- IEEE
- crossref
- conf/softcom/2023
- ee
- https://doi.org/10.23919/SoftCOM58365.2023.10271574
- isbn
- 979-8-3503-0107-6
- url
- http://dblp.uni-trier.de/db/conf/softcom/softcom2023.html#OzolinsOSKPJSKFWMZSYGBLP23
Tags
Users
Comments and Reviewsshow / hide
Cite this publication
More citation styles
- please select -%0 Conference Paper
%1 conf/softcom/OzolinsOSKPJSKFWMZSYGBLP23
%A Ozolins, Oskars
%A Ostrovskis, Armands
%A Salgals, Toms
%A Krüger, Benjamin
%A Pittalà, Fabio
%A Joharifar, Mahdieh
%A Schatz, Richard
%A Koenigsmann, Michael
%A Fan, Yuchuan
%A Westergren, Urban
%A Mardoyan, Haïk
%A Zhang, Lu
%A Spolitis, Sandis
%A Yu, Xianbin
%A Gruen, Markus
%A Bobrovs, Vjaceslavs
%A Louchet, Hadrien
%A Pang, Xiaodan
%B SoftCOM
%D 2023
%I IEEE
%K dblp
%P 1-3
%T High-Baudrate SiP and InP Modulators for Data Center Interconnects.
%U http://dblp.uni-trier.de/db/conf/softcom/softcom2023.html#OzolinsOSKPJSKFWMZSYGBLP23
%@ 979-8-3503-0107-6
@inproceedings{conf/softcom/OzolinsOSKPJSKFWMZSYGBLP23,
added-at = {2024-05-07T00:00:00.000+0200},
author = {Ozolins, Oskars and Ostrovskis, Armands and Salgals, Toms and Krüger, Benjamin and Pittalà, Fabio and Joharifar, Mahdieh and Schatz, Richard and Koenigsmann, Michael and Fan, Yuchuan and Westergren, Urban and Mardoyan, Haïk and Zhang, Lu and Spolitis, Sandis and Yu, Xianbin and Gruen, Markus and Bobrovs, Vjaceslavs and Louchet, Hadrien and Pang, Xiaodan},
biburl = {https://www.bibsonomy.org/bibtex/2dc7111f439b4210908900b0b2873b96d/dblp},
booktitle = {SoftCOM},
crossref = {conf/softcom/2023},
ee = {https://doi.org/10.23919/SoftCOM58365.2023.10271574},
interhash = {254c9de460b6bb2c845a0b4f78b7f0aa},
intrahash = {dc7111f439b4210908900b0b2873b96d},
isbn = {979-8-3503-0107-6},
keywords = {dblp},
pages = {1-3},
publisher = {IEEE},
timestamp = {2024-05-13T08:54:58.000+0200},
title = {High-Baudrate SiP and InP Modulators for Data Center Interconnects.},
url = {http://dblp.uni-trier.de/db/conf/softcom/softcom2023.html#OzolinsOSKPJSKFWMZSYGBLP23},
year = 2023
}