%0 Conference Paper %1 conf/ets/Rodriguez-MontanesAF14 %A Rodríguez-Montañés, Rosa %A Arumí, Daniel %A Figueras, Joan %B ETS %D 2014 %E Natale, Giorgio Di %I IEEE %K dblp %P 1-6 %T Post-bond test of Through-Silicon Vias with open defects. %U http://dblp.uni-trier.de/db/conf/ets/ets2014.html#Rodriguez-MontanesAF14 %@ 978-1-4799-3415-7

@inproceedings{conf/ets/Rodriguez-MontanesAF14, added-at = {2019-10-19T00:00:00.000+0200}, author = {Rodríguez-Montañés, Rosa and Arumí, Daniel and Figueras, Joan}, biburl = {https://www.bibsonomy.org/bibtex/22c09e6d7d77fbf5de9e6514dce53b58c/dblp}, booktitle = {ETS}, crossref = {conf/ets/2014}, editor = {Natale, Giorgio Di}, ee = {https://doi.org/10.1109/ETS.2014.6847816}, interhash = {3e75179656b33d5825f53e465c39891d}, intrahash = {2c09e6d7d77fbf5de9e6514dce53b58c}, isbn = {978-1-4799-3415-7}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2019-10-22T15:56:57.000+0200}, title = {Post-bond test of Through-Silicon Vias with open defects.}, url = {http://dblp.uni-trier.de/db/conf/ets/ets2014.html#Rodriguez-MontanesAF14}, year = 2014 }