%0 Conference Paper %1 conf/embc/BoeserOSSP15 %A Boeser, Fabian %A Ordonez, Juan S. %A Schuettler, Martin %A Stieglitz, Thomas %A Plachta, Dennis T. T. %B EMBC %D 2015 %I IEEE %K dblp %P 809-812 %T Non-hermetic encapsulation for implantable electronic devices based on epoxy. %U http://dblp.uni-trier.de/db/conf/embc/embc2015.html#BoeserOSSP15 %@ 978-1-4244-9271-8

@inproceedings{conf/embc/BoeserOSSP15, added-at = {2021-04-09T00:00:00.000+0200}, author = {Boeser, Fabian and Ordonez, Juan S. and Schuettler, Martin and Stieglitz, Thomas and Plachta, Dennis T. T.}, biburl = {https://www.bibsonomy.org/bibtex/2484ba359ee4bbbebfd3c3b2504141efa/dblp}, booktitle = {EMBC}, crossref = {conf/embc/2015}, ee = {https://www.wikidata.org/entity/Q87024283}, interhash = {7ea95920a744db104384b77e2d08a459}, intrahash = {484ba359ee4bbbebfd3c3b2504141efa}, isbn = {978-1-4244-9271-8}, keywords = {dblp}, pages = {809-812}, publisher = {IEEE}, timestamp = {2024-04-10T04:01:25.000+0200}, title = {Non-hermetic encapsulation for implantable electronic devices based on epoxy.}, url = {http://dblp.uni-trier.de/db/conf/embc/embc2015.html#BoeserOSSP15}, year = 2015 }