%0 Conference Paper %1 conf/ispec2/LeiQWXJB23 %A Lei, Zhengfei %A Qin, Hu %A Wu, Haitao %A Xingliang, Jiang %A Jie, Liu %A Bao, Jiankang %B iSPEC %D 2023 %I IEEE %K dblp %P 1-6 %T Method for monitoring the icing thickness of ground wire using sag measurement technology (iSPEC 2023). %U http://dblp.uni-trier.de/db/conf/ispec2/ispec2023.html#LeiQWXJB23 %@ 979-8-3503-2269-9

@inproceedings{conf/ispec2/LeiQWXJB23, added-at = {2024-02-22T00:00:00.000+0100}, author = {Lei, Zhengfei and Qin, Hu and Wu, Haitao and Xingliang, Jiang and Jie, Liu and Bao, Jiankang}, biburl = {https://www.bibsonomy.org/bibtex/2a8da0307fccd499445e552d89f985a45/dblp}, booktitle = {iSPEC}, crossref = {conf/ispec2/2023}, ee = {https://doi.org/10.1109/iSPEC58282.2023.10403032}, interhash = {9c4a8d7a9fe297e360c87735c0e775ac}, intrahash = {a8da0307fccd499445e552d89f985a45}, isbn = {979-8-3503-2269-9}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2024-04-09T18:19:23.000+0200}, title = {Method for monitoring the icing thickness of ground wire using sag measurement technology (iSPEC 2023).}, url = {http://dblp.uni-trier.de/db/conf/ispec2/ispec2023.html#LeiQWXJB23}, year = 2023 }