%0 Journal Article %1 ieKey %A ?, %D 2002 %J IEEE Transactions on Semiconductor Manufacturing %K CMP CMP_OxideCMP %P pp. 232-244 %T Characterization and Modeling of Oxide Chemical Mechanical Polishing Using Planarization Length and Pattern Density Concepts %V vol. 15, no. 2

@article{ieKey, added-at = {2008-02-16T17:40:48.000+0100}, author = {?}, biburl = {https://www.bibsonomy.org/bibtex/2a98e7abc965db63008db80c945403778/steadycookie}, date = {May 2002}, description = {Publications - MIT Statistical Metrology}, interhash = {980666edef3435de154f0204f357b0e0}, intrahash = {a98e7abc965db63008db80c945403778}, journal = {IEEE Transactions on Semiconductor Manufacturing}, keywords = {CMP CMP_OxideCMP}, pages = {pp. 232-244}, timestamp = {2008-02-16T22:07:04.000+0100}, title = {Characterization and Modeling of Oxide Chemical Mechanical Polishing Using Planarization Length and Pattern Density Concepts}, volume = {vol. 15, no. 2}, year = 2002 }