%0 Journal Article %1 journals/sensors/SuSXLL13 %A Su, Lei %A Shi, Tielin %A Xu, Zhensong %A Lu, Xiangning %A Liao, Guanglan %D 2013 %J Sensors %K dblp %N 12 %P 16281-16291 %T Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer. %U http://dblp.uni-trier.de/db/journals/sensors/sensors13.html#SuSXLL13 %V 13

@article{journals/sensors/SuSXLL13, added-at = {2020-05-30T00:00:00.000+0200}, author = {Su, Lei and Shi, Tielin and Xu, Zhensong and Lu, Xiangning and Liao, Guanglan}, biburl = {https://www.bibsonomy.org/bibtex/21962ed28a77e8b9162816ba29c5b9143/dblp}, ee = {https://www.wikidata.org/entity/Q55518782}, interhash = {c2db602da19bb402f78396fee59817e2}, intrahash = {1962ed28a77e8b9162816ba29c5b9143}, journal = {Sensors}, keywords = {dblp}, number = 12, pages = {16281-16291}, timestamp = {2020-06-02T12:16:20.000+0200}, title = {Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.}, url = {http://dblp.uni-trier.de/db/journals/sensors/sensors13.html#SuSXLL13}, volume = 13, year = 2013 }