Author of the publication

Study of anisotropic conductive adhesive joint behavior under 3-point bending.

, , , and . Microelectron. Reliab., 45 (3-4): 589-596 (2005)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders., , , and . Microelectron. J., 37 (8): 705-713 (2006)FORTLOG = Fortran + Logique.. SPLT, (1985)A criterion for a multi-dimensional explosion due to a concentrated nonlinear source., and . Appl. Math. Lett., 19 (3): 298-302 (2006)Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects., , and . Microelectron. Reliab., 42 (12): 1945-1951 (2002)Bias-HAST on tape ball grid array (TBGA) test pattern., , and . Microelectron. Reliab., 44 (4): 595-602 (2004)Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders., and . Microelectron. Reliab., 54 (5): 945-955 (2014)Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages., , , , and . Microelectron. Reliab., 49 (7): 746-753 (2009)Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads., , and . Microelectron. Reliab., 51 (12): 2306-2313 (2011)Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature., and . Microelectron. Reliab., 42 (8): 1185-1194 (2002)Discrete adaptive sliding-mode tracking controller.. Autom., 33 (5): 999-1002 (1997)