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Disambiguation of "Salman, Emre"

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Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits.

. ISCAS, page 1411-1414. IEEE, (2011)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Emre Türkeli

Retrospektive Analyse der Amnionmembrantransplantation zur Behandlung entzündlicher Erkrankungen der Augenoberfläche. Uni Duisburg-Essen, (2009)

Abdullah Salman Salman

Salman Abdullah Salman

Ahmet Cevat Emre

Ali Haydar Emre

 

Other publications of authors with the same name

Power Distribution in TSV-Based 3-D Processor-Memory Stacks., and . IEEE J. Emerg. Sel. Topics Circuits Syst., 2 (4): 692-703 (2012)Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits.. ISCAS, page 1411-1414. IEEE, (2011)Design space exploration for robust power delivery in TSV based 3-D systems-on-chip., and . SoCC, page 307-311. IEEE, (2012)FinFET-Based Low-Swing Clocking., , , , and . JETC, 12 (2): 13:1-13:20 (2015)Impact of Power Distribution Network on Power Analysis Attacks in Three-Dimensional Integrated Circuits., , , , and . ACM Great Lakes Symposium on VLSI, page 327-332. ACM, (2017)Quantifying the effect of local interconnects on on-chip power distribution., and . Microelectron. J., 46 (3): 258-264 (2015)Perspective Paper - Can AC Computing Be an Alternative for Wirelessly Powered IoT Devices?, , , and . IEEE Embed. Syst. Lett., 9 (1): 13-16 (2017)EQUAL: Efficient QUasi Adiabatic Logic for Enhanced Side-Channel Resistance., and . ISVLSI, page 332-337. IEEE, (2021)A wirelessly powered system with charge recovery logic., , and . ICCD, page 505-510. IEEE Computer Society, (2015)Effect of TSV fabrication technology on power distribution in 3D ICs., and . ACM Great Lakes Symposium on VLSI, page 287-292. ACM, (2013)