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The role of residence times in two-patch dengue transmission dynamics and optimal strategies

, and . Journal of Theoretical Biology, (2015)
DOI: http://dx.doi.org/10.1016/j.jtbi.2015.03.005

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Study on listmode OSEM reconstruction including image-space resolution recovery techniques for compton camera., , , , , , , and . ISBI, page 796-799. IEEE, (2010)The Physics of the B Factories, , , , , , , , , and 2024 other author(s). The European Physical Journal C, (Jul 8, 2014)Search for a light pseudoscalar Higgs boson in the dimuon decay channel in pp collisions at √s = 7 TeV, , , , , , , , , and 2183 other author(s). Phys Rev Lett, 109 (12): 121801-121801 (September 2012)Reliability Characterization of HBM featuring $HK+MG$ Logic Chip with Multi-stacked DRAMs., , , , , , , , and . IRPS, page 1-7. IEEE, (2023)Front-side and Back-side Power Delivery Network Guidelines for 2nm node High Perf Computing and Mobile SoC applications., , , , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC., , , , , , , , and . IRPS, page 1-4. IEEE, (2023)4.1 A 39GHz-Band CMOS 16-Channel Phased-Array Transceiver IC with a Companion Dual-Stream IF Transceiver IC for 5G NR Base-Station Applications., , , , , , , , , and 23 other author(s). ISSCC, page 76-78. IEEE, (2020)Reliability of 8Mbit Embedded-STT-MRAM in 28nm FDSOI Technology., , , , , , , , , and 13 other author(s). IRPS, page 1-3. IEEE, (2019)Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology., , , , , , , , and . IRPS, page 6. IEEE, (2022)Influence of wall charge on image sticking phenomena in AC plasma display panels., , , , , and . Displays, 30 (1): 39-43 (2009)