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2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters., , , , , , , , , и 18 other автор(ы). ISSCC, стр. 46-48. IEEE, (2020)Optimization of a voltage sense amplifier operating in ultra wide voltage range with back bias design techniques in 28nm UTBB FD-SOI technology., , , , и . ICICDT, стр. 53-56. IEEE, (2013)A 3.0μW@5fps QQVGA Self-Controlled Wake-Up Imager with On-Chip Motion Detection, Auto-Exposure and Object Recognition., , , , , , , , , и 1 other автор(ы). VLSI Circuits, стр. 1-2. IEEE, (2020)Ultra-wide voltage range designs in fully-depleted silicon-on-insulator FETs., , , , , , , , , и 10 other автор(ы). DATE, стр. 613-618. EDA Consortium San Jose, CA, USA / ACM DL, (2013)Very High Brightness, High Resolution CMOS Driving Circuit for Microdisplay in Augmented Reality., , , и . MWSCAS, стр. 876-879. IEEE, (2020)Low Standby Power Capacitively Coupled Sense Amplifier for wide voltage range operation of dual rail SRAMs., , , , , , , , и . ICICDT, стр. 1-4. IEEE, (2015)