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Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module

, , , , and . Journal of Electronic Materials, 42 (3): 372-381 (2013)
DOI: 10.1007/s11664-012-2366-1

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Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications, , , , , and . Components, Packaging and Manufacturing Technology, IEEE Transactions on, 4 (12): 1906-1913 (December 2014)Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module, , , , and . Journal of Electronic Materials, 42 (3): 372-381 (2013)