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A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line., , , , , , and . ISSCC, page 52-54. IEEE, (2012)6W/25mm2 inductive power transfer for non-contact wafer-level testing., , , , , , and . ISSCC, page 230-232. IEEE, (2011)A 12Gb/s non-contact interface with coupled transmission lines., , , , , and . ISSCC, page 492-494. IEEE, (2011)An 11Gb/s Inductive-Coupling Link with Burst Transmission., , , , , and . ISSCC, page 298-299. IEEE, (2008)Rotary coding for power reduction and S/N improvement in inductive-coupling data communication., , , and . A-SSCC, page 205-208. IEEE, (2011)Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card., , , , , , and . IEEE J. Solid State Circuits, 47 (10): 2484-2495 (2012)A 12-Gb/s Non-Contact Interface With Coupled Transmission Lines., , , , , and . IEEE J. Solid State Circuits, 48 (3): 790-800 (2013)Design Methodology and Validity Verification for a Reactive Countermeasure Against EM Attacks., , , , , and . J. Cryptol., 30 (2): 373-391 (2017)A 500 MHz-BW -52.5 dB-THD Voltage-to-Time Converter Utilizing Two-Step Transition Inverter Delay Lines in 28 nm CMOS., , , , and . IEICE Trans. Electron., 100-C (6): 560-567 (2017)A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched transmission line couplers and Dicode partial-response channel transceivers., , , , , and . CICC, page 1-4. IEEE, (2012)