Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Heat spreading packaging solutions for hybrid bonded 3D-ICs.

R. Prieto, P. Coudrain, J. Colonna, Y. Hallez, C. Chancel, V. Rat, S. Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, S. Cheramy, and A. Farcy. 3DIC, page 1-6. IEEE, (2016)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Coudrain, Perceval

add a person with the name Coudrain, Perceval

Other publications of authors with the same name

Thermal correlation between measurements and FEM simulations in 3D ICs.P. Souare, F. de Crecy, V. Fiori, M. Jamaa, A. Farcy, S. Gallois-Garreignot, A. Borbely, J. Colonna, P. Coudrain, B. Giraud and 4 other author(s). 3DIC, page 1-6. IEEE, (2013)IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.P. Vivet, E. Guthmuller, Y. Thonnart, G. Pillonnet, C. Tortolero, I. Miro-Panades, G. Moritz, J. Durupt, C. Bernard, D. Varreau and 18 other author(s). IEEE J. Solid State Circuits, 56 (1): 79-97 (2021)Chip to wafer copper direct bonding electrical characterization and thermal cycling.Y. Beilliard, P. Coudrain, L. Cioccio, S. Moreau, L. Sanchez, B. Montmayeul, T. Signamarcheix, R. Estevez, and G. Parry. 3DIC, page 1-7. IEEE, (2013)Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.P. Coudrain, P. Souare, R. Prieto, V. Fiori, A. Farcy, L. Pailleur, J. Colonna, C. Santos, P. Vivet, M. Jamaa and 6 other author(s). IEEE Des. Test, 33 (3): 21-36 (2016)Heat spreading packaging solutions for hybrid bonded 3D-ICs.R. Prieto, P. Coudrain, J. Colonna, Y. Hallez, C. Chancel, V. Rat, S. Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat and 2 other author(s). 3DIC, page 1-6. IEEE, (2016)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.C. Santos, P. Vivet, S. Thuries, O. Billoint, J. Colonna, P. Coudrain, and L. Wang. 3DIC, page 1-5. IEEE, (2016)Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding.Y. Beilliard, S. Moreau, L. Cioccio, P. Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P. Jouneau, E. Rolland, and T. Signamarcheix. 3DIC, page 1-8. IEEE, (2014)Graphite-based heat spreaders for hotspot mitigation in 3D ICs.C. Santos, R. Prieto, P. Vivet, J. Colonna, P. Coudrain, and R. Reis. 3DIC, page TS10.4.1-TS10.4.4. IEEE, (2015)Using TSVs for thermal mitigation in 3D circuits: Wish and truth.C. Santos, P. Souare, F. de Crecy, P. Coudrain, J. Colonna, P. Vivet, A. Borbely, R. Reis, M. Jamaa, V. Fiori and 1 other author(s). 3DIC, page 1-8. IEEE, (2014)3D integration demonstration of a wireless product with design partitioning.G. Druais, P. Ancey, C. Aumont, V. Caubet, L. Chapelon, C. Chaton, S. Cheramy, S. Cordova, E. Cirot, J. Colonna and 17 other author(s). 3DIC, page 1-5. IEEE, (2011)

BibSonomy

Disambiguation of "Coudrain, Perceval"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Please choose a person to relate this publication to

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Coudrain, Perceval"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Please choose a person to relate this publication to

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Heat spreading packaging solutions for hybrid bonded 3D-ICs.