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Wireless power transfer to stacked modules for IoT sensor nodes., , , , and . ISOCC, page 59-60. IEEE, (2017)1W 3.3V-to-16.3V boosting wireless power transfer circuits with vector summing power controller., , , and . A-SSCC, page 177-180. IEEE, (2011)3D clock distribution using vertically/horizontally-coupled resonators., , , and . ISSCC, page 258-259. IEEE, (2013)A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler., , , , , , , and . ISSCC, page 200-201. IEEE, (2013)Transceiver circuits for pulse-based ultra-wideband., , , and . ISCAS (4), page 349-352. IEEE, (2004)Low-latency wireless 3D NoCs via randomized shortcut chips., , , , , , , , and . DATE, page 1-6. European Design and Automation Association, (2014)Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing., , , , , , , and . ISSCC, page 470-471. IEEE, (2009)A 107pJ/b 100kb/s 0.18μm Capacitive-Coupling Transceiver for Printable Communication Sheet., , , , , , , , and . ISSCC, page 292-293. IEEE, (2008)A 10-Bit 80-MS/s Decision-Select Successive Approximation TDC in 65-nm CMOS., , and . IEEE J. Solid State Circuits, 47 (5): 1232-1241 (2012)A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme., , , , , , , and . IEEE J. Solid State Circuits, 46 (4): 965-973 (2011)