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Scaling CMOS beyond Si FinFET: an analog/RF perspective., , , , , , , , , and 4 other author(s). ESSDERC, page 158-161. IEEE, (2018)Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies., , , , , , , , , and 6 other author(s). ESSDERC, page 102-105. IEEE, (2014)Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling., , , , , , , and . ICICDT, page 51-54. IEEE, (2022)Process, Circuit and System Co-optimization of Wafer Level Co-Integrated FinFET with Vertical Nanosheet Selector for STT-MRAM Applications., , , , , , , , , and 2 other author(s). DAC, page 13. ACM, (2019)Beyond-Si materials and devices for more Moore and more than Moore applications., , , , , , , , , and 16 other author(s). ICICDT, page 1-5. IEEE, (2016)Analysis of zero-temperature coefficient behavior on vertically stacked double nanosheet nMOS devices., , , , , and . Microelectron. J., (2021)Optimization of HfSiON using a design of experiment (DOE) approach on 0.45 V Vt Ni-FUSI CMOS transistors., , , , , , , , , and 8 other author(s). Microelectron. Reliab., 47 (4-5): 521-524 (2007)Impact of Device Architecture and Gate Stack Processing on the Low-Frequency Noise of Silicon Nanowire Transistors., , , , , , , and . ASICON, page 1-4. IEEE, (2019)NBTI reliability of Ni FUSI/HfSiON gates: Effect of silicide phase., , , , , , , and . Microelectron. Reliab., 47 (4-5): 505-507 (2007)Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails., , , , , , , , , and 34 other author(s). VLSI Technology and Circuits, page 284-285. IEEE, (2022)