Author of the publication

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.

, , , , and . Microelectron. Reliab., 48 (3): 401-407 (2008)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

A fast moisture sensitivity level qualification method., , , , , , , , and . Microelectron. Reliab., 50 (9-11): 1654-1660 (2010)Numerical prediction of failure paths at a roughened metal/polymer interface., , , and . Microelectron. Reliab., 49 (9-11): 1315-1318 (2009)The need for multi-scale approaches in Cu/low-k reliability issues., , , and . Microelectron. Reliab., 48 (6): 833-842 (2008)Characterization of moisture properties of polymers for IC packaging., , , , , and . Microelectron. Reliab., 47 (9-11): 1685-1689 (2007)Characterization of semiconductor interfaces using a modified mixed mode bending apparatus., , , , and . Microelectron. Reliab., 48 (3): 401-407 (2008)Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics., , , and . Microelectron. Reliab., 49 (8): 853-860 (2009)Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion., , , , and . Microelectron. Reliab., 47 (12): 1975-1982 (2007)Analysis of Cu/low-k bond pad delamination by using a novel failure index., , , , and . Microelectron. Reliab., 47 (2-3): 179-186 (2007)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectron. Reliab., 51 (6): 1069-1076 (2011)Reliability modelling for packages in flexible end-products., , , , , , and . Microelectron. Reliab., 46 (9-11): 1880-1885 (2006)