Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes., and . MBMV, page 1-2. Universitätsbibliothek Berlin, Germany, (2009)Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric., , , and . ISWC, page 86-91. IEEE Computer Society, (2005)Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV., , , , , and . EMV, page 655-664. VDE-Verlag, (2006)Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies., , , , , and . IPSN, page 391-398. ACM, (2006)3-D thin chip integration technology - from technology development to application., , , , , , , and . 3DIC, page 1-8. IEEE, (2009)SENESCOPE: A design tool for cost optimization of wireless sensor nodes., , , , and . IPSN, page 313-324. IEEE Computer Society, (2009)Lamination And Microstructuring Technology for a Bio-Cell Multiwell array, , , , , , , , , and . CoRR, (2008)Stretchable Circuit Board Technology and Application., , , , , , and . ISWC, page 33-36. IEEE Computer Society, (2009)Vorhersage von magnetischen Kopplungen in Filterschaltungen., , , , and . EMV, page 173-180. VDE-Verlag, (2006)Characterization of bump arrays at RF/microwave frequencies., , , and . Microelectron. Reliab., 45 (3-4): 551-558 (2005)