%0 Conference Paper %1 conf/3dic/GhoshYTT13 %A Ghosh, Kaushik %A Yap, C. C. %A Tay, Beng Kang %A Tan, Chuan Seng %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#GhoshYTT13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/GhoshYTT13, added-at = {2022-01-20T00:00:00.000+0100}, author = {Ghosh, Kaushik and Yap, C. C. and Tay, Beng Kang and Tan, Chuan Seng}, biburl = {https://www.bibsonomy.org/bibtex/2efdb20a67de2fed22312cacd048569a2/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702369}, interhash = {08ebe48d4cbf1d6f95f2a10ddcbfaafe}, intrahash = {efdb20a67de2fed22312cacd048569a2}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:52.000+0200}, title = {Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#GhoshYTT13}, year = 2013 }