Abstract
Boron and phosphorus passivation in silicon metal-oxide-semiconductor
(MOS) capacitors under x-ray irradiation follows a power law in the form
Delta N/N-0 similar to (dose)(alpha), with 1/2 less than or equal to
alpha less than or equal to 1, depending on processing parameters and
the device history before irradiation. The minimum x-ray dose for
observation of dopant passivation in fluorinated p-type MOS capacitors
is smaller when the time interval between fabrication and subsequent
irradiation increases. We reason that room-temperature ageing within
this timescale is a result of either adsorption of water or gradual
reactions of fluorine with hydrogen, silicon or oxygen-related species
in the neighbourhood of the SiO2/Si interface.
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