%0 Conference Paper %1 conf/embc/KongPC22 %A Kong, Youngsun %A Posada-Quintero, Hugo F. %A Chon, Ki H. %B EMBC %D 2022 %I IEEE %K dblp %P 2475-2478 %T Multi-level Pain Quantification using a Smartphone and Electrodermal Activity. %U http://dblp.uni-trier.de/db/conf/embc/embc2022.html#KongPC22 %@ 978-1-7281-2782-8

@inproceedings{conf/embc/KongPC22, added-at = {2022-09-22T00:00:00.000+0200}, author = {Kong, Youngsun and Posada-Quintero, Hugo F. and Chon, Ki H.}, biburl = {https://www.bibsonomy.org/bibtex/220e1a887a783d46f9c1e6c4b9a9f8e9c/dblp}, booktitle = {EMBC}, crossref = {conf/embc/2022}, ee = {https://doi.org/10.1109/EMBC48229.2022.9871228}, interhash = {0c1fb7ed0aff4bf6a4f238fdbfebfccd}, intrahash = {20e1a887a783d46f9c1e6c4b9a9f8e9c}, isbn = {978-1-7281-2782-8}, keywords = {dblp}, pages = {2475-2478}, publisher = {IEEE}, timestamp = {2024-04-09T14:37:56.000+0200}, title = {Multi-level Pain Quantification using a Smartphone and Electrodermal Activity.}, url = {http://dblp.uni-trier.de/db/conf/embc/embc2022.html#KongPC22}, year = 2022 }