%0 Conference Paper %1 conf/3dic/KinoFT19 %A Kino, Hisashi %A Fukushima, Takafumi %A Tanaka, Tetsu %B 3DIC %D 2019 %I IEEE %K dblp %P 1-4 %T Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#KinoFT19 %@ 978-1-7281-4870-0

@inproceedings{conf/3dic/KinoFT19, added-at = {2021-10-14T00:00:00.000+0200}, author = {Kino, Hisashi and Fukushima, Takafumi and Tanaka, Tetsu}, biburl = {https://www.bibsonomy.org/bibtex/2a1ec2f213765d00ccfec5f9a910a604c/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2019}, ee = {https://doi.org/10.1109/3DIC48104.2019.9058838}, interhash = {1703b9386eef70a22dd94b7c6bab0126}, intrahash = {a1ec2f213765d00ccfec5f9a910a604c}, isbn = {978-1-7281-4870-0}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:03.000+0200}, title = {Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#KinoFT19}, year = 2019 }