%0 Conference Paper %1 conf/3dic/JourdainBPPWSBBTS10 %A Jourdain, Anne %A Buisson, Thibault %A Phommahaxay, Alain %A Privett, Mark %A Wallace, Dan %A Sood, Sumant %A Bisson, Peter %A Beyne, Eric %A Travaly, Youssef %A Swinnen, Bart %B 3DIC %D 2010 %I IEEE %K dblp %P 1-4 %T 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#JourdainBPPWSBBTS10 %@ 978-1-4577-0526-7

@inproceedings{conf/3dic/JourdainBPPWSBBTS10, added-at = {2021-10-14T00:00:00.000+0200}, author = {Jourdain, Anne and Buisson, Thibault and Phommahaxay, Alain and Privett, Mark and Wallace, Dan and Sood, Sumant and Bisson, Peter and Beyne, Eric and Travaly, Youssef and Swinnen, Bart}, biburl = {https://www.bibsonomy.org/bibtex/2c0af819ce4de0afdfcf1f2b20e863558/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2010}, ee = {https://doi.org/10.1109/3DIC.2010.5751468}, interhash = {17a79173cd3dc567eb5517714ecef227}, intrahash = {c0af819ce4de0afdfcf1f2b20e863558}, isbn = {978-1-4577-0526-7}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:20.000+0200}, title = {300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#JourdainBPPWSBBTS10}, year = 2010 }