%0 Conference Paper %1 conf/emccompo/DegraevePA15 %A Degraeve, Andy %A Pissoort, Davy %A Armstrong, Keith %B EMC Compo %D 2015 %I IEEE %K dblp %P 50-55 %T Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principle. %U http://dblp.uni-trier.de/db/conf/emccompo/emccompo2015.html#DegraevePA15 %@ 978-1-4673-7897-0

@inproceedings{conf/emccompo/DegraevePA15, added-at = {2019-06-13T00:00:00.000+0200}, author = {Degraeve, Andy and Pissoort, Davy and Armstrong, Keith}, biburl = {https://www.bibsonomy.org/bibtex/27fb24ae6c4ff447a41affaee61ac67e5/dblp}, booktitle = {EMC Compo}, crossref = {conf/emccompo/2015}, ee = {https://doi.org/10.1109/EMCCompo.2015.7358329}, interhash = {1c35fd4004e564901742624678bcca1d}, intrahash = {7fb24ae6c4ff447a41affaee61ac67e5}, isbn = {978-1-4673-7897-0}, keywords = {dblp}, pages = {50-55}, publisher = {IEEE}, timestamp = {2019-10-17T16:13:51.000+0200}, title = {Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principle.}, url = {http://dblp.uni-trier.de/db/conf/emccompo/emccompo2015.html#DegraevePA15}, year = 2015 }