%0 Conference Paper %1 conf/irps/OmiyaKSKSNSNSN15 %A Omiya, Masaki %A Kamiya, Shoji %A Shishido, Nobuyuki %A Koiwa, Kozo %A Sato, Hisashi %A Nishida, Masahiro %A Suzuki, Takashi %A Nakamura, Tomoji %A Suzuki, Toshiaki %A Nokuo, Takeshi %B IRPS %D 2015 %I IEEE %K dblp %P 5 %T Scenario for catastrophic failure in interconnect structures under chip package interaction. %U http://dblp.uni-trier.de/db/conf/irps/irps2015.html#OmiyaKSKSNSNSN15 %@ 978-1-4673-7362-3

@inproceedings{conf/irps/OmiyaKSKSNSNSN15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Omiya, Masaki and Kamiya, Shoji and Shishido, Nobuyuki and Koiwa, Kozo and Sato, Hisashi and Nishida, Masahiro and Suzuki, Takashi and Nakamura, Tomoji and Suzuki, Toshiaki and Nokuo, Takeshi}, biburl = {https://www.bibsonomy.org/bibtex/23d4e74bc28e7baff929483ae950fd5d3/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2015}, ee = {https://doi.org/10.1109/IRPS.2015.7112751}, interhash = {25b35f3f02bc2c2b7b4c77006ce0c450}, intrahash = {3d4e74bc28e7baff929483ae950fd5d3}, isbn = {978-1-4673-7362-3}, keywords = {dblp}, pages = 5, publisher = {IEEE}, timestamp = {2019-10-17T14:45:48.000+0200}, title = {Scenario for catastrophic failure in interconnect structures under chip package interaction.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2015.html#OmiyaKSKSNSNSN15}, year = 2015 }