%0 Conference Paper %1 conf/3dic/HashimotoFLKT13 %A Hashimoto, Hiroyuki %A Fukushima, Takafumi %A Lee, Kang Wook %A Koyanagi, Mitsumasa %A Tanaka, Tetsu %B 3DIC %D 2013 %I IEEE %K dblp %P 1-5 %T Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#HashimotoFLKT13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/HashimotoFLKT13, added-at = {2021-02-16T00:00:00.000+0100}, author = {Hashimoto, Hiroyuki and Fukushima, Takafumi and Lee, Kang Wook and Koyanagi, Mitsumasa and Tanaka, Tetsu}, biburl = {https://www.bibsonomy.org/bibtex/238e76fd7e8762baeacb575f3715f7cce/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702338}, interhash = {12f0a0387324925211ab1108783cae68}, intrahash = {38e76fd7e8762baeacb575f3715f7cce}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:52.000+0200}, title = {Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#HashimotoFLKT13}, year = 2013 }