Inproceedings,
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
W. Guo, G. der Plas, A. Ivankovic, G. Eneman, V. Cherman, B. Wachter, A. Mercha, M. Gonzalez, Y. Civale, A. Redolfi, T. Buisson, A. Jourdan, B. Vandevelde, K. Rebibis, I. Wolf, A. Manna, G. Beyer, E. Beyne, and B. Swinnen.ICICDT, page 1-4. IEEE, (2012)
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- conf/icicdt/GuoPIECWMGCRBJV12
- entry type
- inproceedings
- booktitle
- ICICDT
- year
- 2012
- pages
- 1-4
- publisher
- IEEE
- crossref
- conf/icicdt/2012
- ee
- https://doi.org/10.1109/ICICDT.2012.6232855
- isbn
- 978-1-4673-0146-6
- url
- http://dblp.uni-trier.de/db/conf/icicdt/icicdt2012.html#GuoPIECWMGCRBJV12
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%1 conf/icicdt/GuoPIECWMGCRBJV12
%A Guo, Wei
%A der Plas, Geert Van
%A Ivankovic, Andrej
%A Eneman, Geert
%A Cherman, Vladimir
%A Wachter, Bart De
%A Mercha, Abdelkarim
%A Gonzalez, Mario
%A Civale, Yann
%A Redolfi, Augusto
%A Buisson, Thibault
%A Jourdan, A.
%A Vandevelde, Bart
%A Rebibis, Kenneth J.
%A Wolf, Ingrid De
%A Manna, Antonio La
%A Beyer, Gerald
%A Beyne, Eric
%A Swinnen, Bart
%B ICICDT
%D 2012
%I IEEE
%K dblp
%P 1-4
%T 3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
%U http://dblp.uni-trier.de/db/conf/icicdt/icicdt2012.html#GuoPIECWMGCRBJV12
%@ 978-1-4673-0146-6
@inproceedings{conf/icicdt/GuoPIECWMGCRBJV12,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Guo, Wei and der Plas, Geert Van and Ivankovic, Andrej and Eneman, Geert and Cherman, Vladimir and Wachter, Bart De and Mercha, Abdelkarim and Gonzalez, Mario and Civale, Yann and Redolfi, Augusto and Buisson, Thibault and Jourdan, A. and Vandevelde, Bart and Rebibis, Kenneth J. and Wolf, Ingrid De and Manna, Antonio La and Beyer, Gerald and Beyne, Eric and Swinnen, Bart},
biburl = {https://www.bibsonomy.org/bibtex/2b322bd0e139841b1f8937b4233a4e38a/dblp},
booktitle = {ICICDT},
crossref = {conf/icicdt/2012},
ee = {https://doi.org/10.1109/ICICDT.2012.6232855},
interhash = {3b0e9c344085d7e933e4f4777e7e1a6d},
intrahash = {b322bd0e139841b1f8937b4233a4e38a},
isbn = {978-1-4673-0146-6},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2024-04-10T21:05:54.000+0200},
title = {3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.},
url = {http://dblp.uni-trier.de/db/conf/icicdt/icicdt2012.html#GuoPIECWMGCRBJV12},
year = 2012
}