%0 Journal Article %1 journals/mr/LimYRLW13 %A Lim, Ju Dy %A Yi, Susan Yeow Su %A Rhee, MinWoo Daniel %A Leong, Kam Chew %A Wong, Chee Cheong %D 2013 %J Microelectron. Reliab. %K dblp %N 9-11 %P 1548-1552 %T Surface roughness effect on copper-alumina adhesion. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#LimYRLW13 %V 53

@article{journals/mr/LimYRLW13, added-at = {2020-02-22T00:00:00.000+0100}, author = {Lim, Ju Dy and Yi, Susan Yeow Su and Rhee, MinWoo Daniel and Leong, Kam Chew and Wong, Chee Cheong}, biburl = {https://www.bibsonomy.org/bibtex/275a16c0d6eec52933cd65df9497cf233/dblp}, ee = {https://doi.org/10.1016/j.microrel.2013.07.016}, interhash = {3bb179d51ff4259d3ee1a1f9330aa54c}, intrahash = {75a16c0d6eec52933cd65df9497cf233}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-11}, pages = {1548-1552}, timestamp = {2020-02-25T13:22:12.000+0100}, title = {Surface roughness effect on copper-alumina adhesion.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#LimYRLW13}, volume = 53, year = 2013 }