%0 Journal Article %1 journals/tcad/YangGZDS07 %A Yang, Yonghong %A Gu, Zhenyu (Peter) %A Zhu, Changyun %A Dick, Robert P. %A Shang, Li %D 2007 %J IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. %K dblp %N 1 %P 86-99 %T ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis. %U http://dblp.uni-trier.de/db/journals/tcad/tcad26.html#YangGZDS07 %V 26

@article{journals/tcad/YangGZDS07, added-at = {2020-09-24T00:00:00.000+0200}, author = {Yang, Yonghong and Gu, Zhenyu (Peter) and Zhu, Changyun and Dick, Robert P. and Shang, Li}, biburl = {https://www.bibsonomy.org/bibtex/25fb2dc693974020d3131d05cbb35f269/dblp}, ee = {https://doi.org/10.1109/TCAD.2006.882589}, interhash = {4d332ada748e763f5cd29eaf33c3668a}, intrahash = {5fb2dc693974020d3131d05cbb35f269}, journal = {IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.}, keywords = {dblp}, number = 1, pages = {86-99}, timestamp = {2020-09-25T11:48:15.000+0200}, title = {ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad26.html#YangGZDS07}, volume = 26, year = 2007 }