%0 Conference Paper %1 conf/isvlsi/ChengTBDGVVB13 %A Cheng, Yuanqing %A Todri-Sanial, Aida %A Bosio, Alberto %A Dillio, Luigi %A Girard, Patrick %A Virazel, Arnaud %A Vivet, Pascal %A Belleville, Marc %B ISVLSI %D 2013 %I IEEE Computer Socity %K dblp %P 121-126 %T A novel method to mitigate TSV electromigration for 3D ICs. %U http://dblp.uni-trier.de/db/conf/isvlsi/isvlsi2013.html#ChengTBDGVVB13 %@ 978-1-4799-1331-2

@inproceedings{conf/isvlsi/ChengTBDGVVB13, added-at = {2023-03-24T00:00:00.000+0100}, author = {Cheng, Yuanqing and Todri-Sanial, Aida and Bosio, Alberto and Dillio, Luigi and Girard, Patrick and Virazel, Arnaud and Vivet, Pascal and Belleville, Marc}, biburl = {https://www.bibsonomy.org/bibtex/299a0f3a7fa3d290330b069868efa46fe/dblp}, booktitle = {ISVLSI}, crossref = {conf/isvlsi/2013}, ee = {https://doi.ieeecomputersociety.org/10.1109/ISVLSI.2013.6654633}, interhash = {58ca5f4c9e5b2f2551f2514c1c8ee1ee}, intrahash = {99a0f3a7fa3d290330b069868efa46fe}, isbn = {978-1-4799-1331-2}, keywords = {dblp}, pages = {121-126}, publisher = {IEEE Computer Socity}, timestamp = {2024-04-10T11:07:21.000+0200}, title = {A novel method to mitigate TSV electromigration for 3D ICs.}, url = {http://dblp.uni-trier.de/db/conf/isvlsi/isvlsi2013.html#ChengTBDGVVB13}, year = 2013 }