%0 Conference Paper %1 conf/3dic/ErogluCL16 %A Eroglu, S. E. Kucuk %A Choo, W. Y. %A Leblebici, Yusuf %B 3DIC %D 2016 %I IEEE %K dblp %P 1-5 %T Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#ErogluCL16 %@ 978-1-5090-1399-9

@inproceedings{conf/3dic/ErogluCL16, added-at = {2017-07-13T00:00:00.000+0200}, author = {Eroglu, S. E. Kucuk and Choo, W. Y. and Leblebici, Yusuf}, biburl = {https://www.bibsonomy.org/bibtex/2af22f090bb03d22f360ee9fe7ba6cd74/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2016}, ee = {https://doi.org/10.1109/3DIC.2016.7970016}, interhash = {6d2f8d1649287cc5fe5a0faf3ee856dc}, intrahash = {af22f090bb03d22f360ee9fe7ba6cd74}, isbn = {978-1-5090-1399-9}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:46.000+0200}, title = {Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#ErogluCL16}, year = 2016 }